 |
||
        |
||
 |
||
General Information Organizing Committee TPC Photo Program at a Glance Final Program (PDF) |
|
Organizing Committee
Technical Program Committee Members
Arch, David - Honeywell International Arnold, David - University of Florida Boser, Bernard - University of California at Berkeley Bustillo, James M. - Lawrence Berkeley National Laboratory Casalnuovo, Stephen - Sandia National Laboratory Fedder, Gary - Carnegie Mellon University Hoen, Storrs - Agilent Labs Huff, Michael A. - MEMS and Nanotechnology Exchange Jerman, Hal - Coherent, Inc. Kenny, Thomas - Stanford University Kim, Sang-Gook - Massachusetts Institute of Technology Knobloch, Aaron - General Electric/Global Research Mehrengany, Mehran - Case Western Reserve University Monk, David - Freescale Payne, Richie - Pixtronix, Inc. Putty, Michael - Delphi Research Labs Ricco, Antonio - NASA Ames Research Center Spangler, Leland "Chip" - Aspen Technologies Tatic-Lucic, Svetlana - Lehigh University Taylor, William P. - Allegro Microsystems, Inc. Turner, Kim - University of California at Santa Barbara Zhang, Xin - Boston University  From left to right, starting in the front First (Front) Row: Sang-Gook Kim, Michael Putty, Aaron Knobloch, Xin Zhang, Dave Monk, Leland "Chip" Spangler (Technical Program Chair), James M. Bustillo, Mehran Mehregany Second (Middle) Row: Stephen Casalnuovo, Hal Jerman, Richard S. Payne, Kimberly L. Turner, Svetlana Tatic-Lucic, Antonio J. Ricco, David Arch Third (Back) Row: Gary K. Fedder, Storrs Hoen, William P. Taylor, David Arnold, Thomas W. Kenny (General Chair), Michael A. Huff Not Pictured: Bernhard E. Boser |